Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Place and Route for Dense High-Speed and RF Circuits

Speaker

Michael R. Creeden
CID+, Insulectro

Duration
 4min 32sec

This presentation will offer a complete view of place-and-route for dense high-speed and RF circuits. We will cover a wide range of topics, including next-generation materials, the rational for considering HDI for our products, and overall layout flow. We will discuss the technological challenges we face in both the schematic circuit rules capture, design layout and manufacturing process. Students will learn what it takes to satisfy solvability, high-speed concerns, and RF performance issues, while building a board that will be cost-effective as a reliable high-yield product. We will also review how our early integration with the manufacturing team during the design cycle will help us understand the specifics to build a product that is correct-by-construction and performs on revision-1. The focus will be on practical application and implementation using real-world examples.

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Speaker  :  
Ata Syed
Company : 
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Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides...
Speaker  :  
Ata Syed
Company : 
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Speaker  :  
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Speaker  :  
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Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Vern Solberg
Company : 
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Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
John Coonrod
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Speaker  :  
Bill Hargin
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Speaker  :  
Paul Cooke
Company : 
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This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
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Speaker  :  
Doug Brooks and Dr. Johannes Adam
Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...
Speaker  :  
Ata Syed
Company : 
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Speaker  :  
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Robert Carter
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Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
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Speaker  :  
Atar Mittal
Company : 
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Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the...
Speaker  :  
Keven Coates,
Company : 
Geospace Technologies
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood....
Speaker  :  
Ralf Bruening
Company : 
Zuken
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker  :  
Dan Beeker
Company : 
NXP Semiconductor
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Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Susy Webb
Company : 
Design Science
Skill Level : 
Audience: 
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Speaker  :  
Keven Coates
Company : 
Geospace Technologies
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker  :  
Jamie Pacamarra
Company : 
Analog Devices
Skill Level : 
Audience: 
When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker  :  
Elizabeth Bustamante
Company : 
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When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker  :  
Bill Hargin
Company : 
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker  :  
Susy Webb
Company : 
Design Science
Skill Level : 
Audience: 
There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses...
Speaker  :  
Paul Cooke
Company : 
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This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker  :  
Eric Bogatin
Company : 
Teledyne LeCroy
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
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Phil Zarrow
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Speaker  :  
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The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
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Ethan Pierce
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Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
John Coonrod
Company : 
Rogers Corp.
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...

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