The AI boom is putting pressure on PCB supply chains, with key substrate materials potentially falling 20 percent short of demand in 2027. Meanwhile, researchers are proposing reconfigurable MEMS switches that could conceal chip package wiring from X-ray reverse engineering.

Researchers propose reconfigurable MEMS switches that hide chip package wiring from reverse engineering by X-ray.

PCEA will host a free webinar Nov. 17 featuring Yash Sutariya discussing global PCB supply chain disruptions, sourcing risks and strategies for strengthening supply resilience.

Seoul National University and Samsung have developed a next-generation memory device.

A new study proposes an anti-disturbance adaptive control strategy for DC-DC boost converters used in EVs, energy storage and microgrids.

A new ESD-safe PETG 3D printing filament can be used for fixtures that sit directly against live PCB panels on the assembly line.

PCEA opened registration for PCB East 2027, featuring 120 hours of technical training, 28 new classes and a one-day exhibition in the Boston suburbs.

PCEA has opened its call for abstracts for PCB West 2027, scheduled for September 14–17 in Santa Clara, CA, with submissions due January 8, 2027.

PCEA will host a free webinar Dec. 8 featuring Asaf Israelit discussing how AI can optimize entire BoMs, identify component alternatives, reduce costs and address supply chain risks before production.

PCEA Training announced its winter and spring 2027 schedule for the Certified Professional Circuit Designer (CPCD) program, with online classes beginning Jan. 15 and Mar. 19 and an in-person session April 26–30 at PCB East.

CIRCUITS ASSEMBLY is accepting entries for the 20th annual New Product Introduction Awards, with submissions for electronics assembly products due Dec. 14.

Looking for networking opportunities? Join the PCEA Discord server, bringing together engineers and designers from around the world on a private channel for discussing technical questions and career opportunities.

Low-CTE glass fiber, CCL and ABF substrate materials could be about 20 percent short of 2027 demand.

China is locking in export power by supplying the world’s factory equipment, using PCB maker Sihui Fuji Electronic Technology.

MBK Partners has signed a deal to sell control of NexFlex, Korea’s top flexible CCL (FCCL) maker.

Foxconn’s ASIC AI server shipments grew 1.5x year over year in the third quarter.

Flex is targeting an adjusted operating margin of at least 7 percent by 2029 and shifting toward higher-margin markets as the Axiom spin-off reshapes the company.

Samsung Electronics is in talks to acquire Modine Manufacturing, which makes cooling systems for data centers.

NewFlex Technology filed an operations update on its flexible PCB business, reporting no changes to its subsidiaries or core business.

Box build made up 61 percent of Avalon Technologies’ total revenue in the first half of the year, part of a model that combines PCB design and assembly, cables, and metal fabrication.

APD has opened a Shenzhen facility with auto-insertion and high-speed SMT lines as part of integrating its two plants.

is investing $37M in Hongcheon, Korea, including upgrading its SMT equipment from semi-automatic to fully automatic.

Embedded Die Substrate Technology
PCD&F/CIRCUITS ASSEMBLY

Liquid Metal Interfaces for Component Mounting on Kirigami Stretchable Substrates
Nature

TB 26-10 Printed Circuit Board Assembly Chip Resistor Body Cracking
NASA

EVENTS

PCB Update is a digital newsletter for PCB design, fabrication and assembly professionals, brought to you by Printed Circuit Engineering Association™. E-mail industry press releases or links to the editors of CIRCUITS ASSEMBLY or PCD&F: [email protected].