Skill Level Advanced
More than 10 years’ experience in in printed circuit board engineering or design, and/or exceptional knowledge of the particular topic.
Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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Skill Level
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Speaker :
Susy Webb
Company :
Design Science
Skill Level :
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering...
Speaker :
Zachariah Peterson
Company :
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Speaker :
Fumiyasu Ohbuchi
Company :
Siemens
Skill Level :
With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Lee Ritchey
Company :
Speeding Edge
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker :
Ralf Bruening
Company :
Zuken
Skill Level :
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker :
Dan Beeker
Company :
NXP Semiconductor
Skill Level :
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker :
Eric Bogatin
Company :
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker :
Elizabeth Bustamante
Company :
SnapEDA
Skill Level :
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker :
Paul Cooke
Company :
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
Speaker :
Lee Ritchey
Company :
Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
