Components/Packaging
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Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Daniel J. Smith
Company :
Raytheon SAS
Skill Level :
Audience:
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker :
Elizabeth Bustamante
Company :
SnapEDA
Skill Level :
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker :
Paul Cooke
Company :
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker :
Phil Zarrow
Company :
ITM Consulting
Skill Level :
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
