This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the... [more]
Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]