Mechanical Design to Control EMI

As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those... [more]

Millimeter-Wave Concepts Can be Used to Optimize the Performance of High-Speed Digital Circuits

Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

PCB Problem Solving – PCB 102

This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]