With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering... [more]
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers Flex layer processing and stackup Polyimides... [more]