High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed... [more]