Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
Current Workshops
PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
The Case for Split Ground Planes
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the... [more]
The Basics of PCB Design
Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the... [more]
Effective PCB Design: Techniques to Improve Performance
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more... [more]
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