When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar? What is... [more]