As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that... [more]
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This... [more]