Printed Circuit Board Stackup Design for High-Performance Products

This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very... [more]

Does a Differential Pair Need a Return Plane?

A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no... [more]

Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines

Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]