Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar? What is... [more]
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]