The 5 Ws of Flex Circuits

The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits: What is flex? Why use flex? Who should know flex? When to use flex Where to use flex   Presenter Ata Syed is... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Materials of Flex Circuits: Specifications and Applications

Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides... [more]

Mechanical Design to Control EMI

As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those... [more]