This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]