Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very... [more]
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties... [more]