Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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Audience
- Fabricator Engineer/Operator
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Ata Syed
Company :
PFC Flexible Circuits
Skill Level :
Materials of Flex Circuits: Specifications and Applications covers the following:
Coverlays, cores, bond plies, adhesives and their suppliers
Flex layer processing and stackup
Polyimides...
Speaker :
Ata Syed
Company :
PFC Flexible Circuits
Skill Level :
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits:
What is flex?
Why use flex?
Who should know flex?
When to use flex
Where to use flex
Presenter Ata Syed is...
Speaker :
Zachariah Peterson
Company :
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Lee Ritchey
Company :
Speeding Edge
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Bill Hargin
Company :
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker :
Paul Cooke
Company :
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker :
Eric Bogatin
Company :
Teledyne LeCroy
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
Speaker :
Lee Ritchey
Company :
Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
