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Assembly Processes

Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies

Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to accommodate higher speeds, and good Signal/Power Integrity. One solution to this emerging technological challenge is embedded capacitance technology.

Use of planar embedded capacitance will reduce overall inductance of the power distribution network as well as free up surface real estate by removing discrete capacitors. Ultra-thin laminates with high capacitance and Dk will also help reduce noise. Additionally, embedded capacitance technology offers better reliability due to having less components on the PCB surface.

The course will cover important aspects of utilizing embedded capacitance technology in order to enhance PCB design. Below is the course outline:

1. Improve Power Delivery, Signal Integrity and Reduce Noise with Embedded
– Robert Carter, Oak-Mitsui Technologies
2. Implementing Embedded Capacitance – Cad Tool Schematic and Layout
– Chris Carlson, Altium
3. Implementing Embedded Capacitance – How to Run Simulation
– Yoshi Fukawa, TechDream
4. Processing Embedded Capacitance Ulta-Thin Laminates
– Robert Carter, Oak-Mitsui Technologies
5. Characterization of Embedded Capacitance Material with Near Field Measurement
– Jin Min, Amber Precision Instruments)

Speaker  :  
Phil Zarrow
Company : 
ITM Consulting

This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is covered in depth. It looks at the design impact on SMT assembly, component placement, soldering, paste and final finish considerations, and manufacturing implications of emerging technologies including BTCs, ultra-miniature passives, and ultra-fine pitch IC packages.

Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence

The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for virtual prototyping of all aspects of design, manufacturing and beyond. Use of IPC-2551 prevents companies in all areas of the industry from making the mistake of tying themselves to any monopolistic data exchange technology. The impact of the IPC Digital Twin on the design through manufacturing flow will be significant, and will be the area that develops sooner than any other, built upon and driven by existing IPC standards, such as IPC-2581 (DPMX), IPC-2591 (CfX) and IPC-1782 internal and external (secure supply-chain) traceability. This presentation explains the IPC Digital Twin standard, using some specific use-case examples that illustrate the value and opportunity that the standard provides to both the design and manufacturing communities, exchanging digital models bidirectionally between design and manufacturing. This presentation will be of critical interest to all of those involved in design and manufacturing, including business management, engineers and technology providers.

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