AI in Electronics

As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that... [more]

Causes of Signal Degradation in PCB Transmission Lines

Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Designing the Signal Return Path

When designing a PCB, the signal routing and its return are critical to the circuit working properly. Great care is usually given to routing the signals, but often the return portion is the last... [more]