With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering... [more]
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very... [more]
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]