Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for... [more]
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is... [more]