Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood.... [more]
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]