Best DFM Practices for Board Engineers

There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering... [more]

From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing

The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]

PCB Design Techniques to Improve ESD Robustness

Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The... [more]

Materials of Flex Circuits: Specifications and Applications

Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides... [more]