Materials of Flex Circuits: Specifications and Applications

Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides... [more]

Printed Circuit Board Stackup Design for High-Performance Products

This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very... [more]

Routing Digital Boards to Avoid Problems

There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses... [more]

Embedded Capacitance Technology Concept: Design, Implementation, and Processing Guidelines

Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to... [more]