Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers Flex layer processing and stackup Polyimides... [more]
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The... [more]
When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the... [more]
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,... [more]