Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how... [more]
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very... [more]