Designing and Analyzing High Frequency Interconnects

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]

From Smart Factory Automation to Digital Twin Standard: Ushering a New Era for Design and Manufacturing

The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]

The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board

When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the... [more]

Manufacturing by Design is the New DfM

Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and... [more]