PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Manufacturing by Design is the New DfM

Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and... [more]

The PCB Design Process from Cradle to Grave

This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed... [more]

Mechanical Design to Control EMI

As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those... [more]