This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers Flex layer processing and stackup Polyimides... [more]
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed... [more]
There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses... [more]