Reverse Engineering PCBs: How to Recreate a Lost Design

Maintaining a product is very difficult when: The source files aren’t available Only Gerber files and maintenance documents are available Making a revision to a company-owned product with no... [more]

Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!

The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Next-Generation Materials: High-Speed, RF and HDI Designs

With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]