Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

DfF/DfM/DfA/DfT

Speaker  :  
Fumiyasu Ohbuchi
Company : 
Siemens

With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA assembly lines. The new SMT Equipment Link Standards (SEMI SMT-ELS) or SEMI A1, A1.1 and A2 address Horizontal Communication (HC) between different equipment on the line and Vertical Communication (VC) between equipment and higher-tier hosts, including, for example, a line controller/equipment host or a factory automation host. SEMI is well-known for its SECS/GEM/EDA standards, which are almost universally adopted in the front-end processing fabs where frequent job changes and recipe changes are common. The SMT-ELS suite adjusts to the specific needs of SMT lines, including more operator interaction, minimal data collection requirements, material metadata handoffs between equipment, and minimal queuing. This presentation goes into detail on the design and features of SMT-ELS, including set up time and configurations.

Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker  :  
Phil Zarrow
Company : 
ITM Consulting
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker  :  
Benjamin Jordan
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the...
Speaker  :  
Keven Coates,
Company : 
Geospace Technologies
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood....
Speaker  :  
Ralf Bruening
Company : 
Zuken
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker  :  
Dan Beeker
Company : 
NXP Semiconductor
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...

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