Skill Level Beginner
Fewer than five years’ experience in printed circuit board engineering or design, and/or limited knowledge of the particular topic.
Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Ata Syed
Company :
PFC Flexible Circuits
Skill Level :
Materials of Flex Circuits: Specifications and Applications covers the following:
Coverlays, cores, bond plies, adhesives and their suppliers
Flex layer processing and stackup
Polyimides...
Speaker :
Doug Brooks and Dr. Johannes Adam
Skill Level :
Stop thinking about current density!
In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...
Speaker :
Ata Syed
Company :
PFC Flexible Circuits
Skill Level :
The 5 Ws of Flex Circuits is a breakdown of the basics of flexible circuits:
What is flex?
Why use flex?
Who should know flex?
When to use flex
Where to use flex
Presenter Ata Syed is...
Speaker :
Richard Weiland
Company :
HZO
Skill Level :
Engineered Reliability: Safeguarding Electrical Components and Devices with Nanocoating Technology, focuses on real-world examples of where significant product challenges were presented (such as...
Speaker :
Ethan Pierce
Company :
Pierce Design
Skill Level :
Maintaining a product is very difficult when:
The source files aren’t available
Only Gerber files and maintenance documents are available
Making a revision to a company-owned product with no...
Speaker :
Susy Webb
Company :
Design Science
Skill Level :
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering...
Speaker :
Greg Papandrew
Company :
Better Board Buyer
Skill Level :
Audience:
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar?
What is...
Speaker :
Fumiyasu Ohbuchi
Company :
Siemens
Skill Level :
With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
Speaker :
Lee Ritchey
Company :
Speeding Edge
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker :
Daniel J. Smith
Company :
Raytheon SAS
Skill Level :
Audience:
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker :
Keven Coates,
Company :
Geospace Technologies
Skill Level :
What is a wire? At high speeds, it behaves very differently from what we were taught in college. This presentation on high-speed basics makes the subject intuitive in a way that’s easily understood....
Speaker :
Ralf Bruening
Company :
Zuken
Skill Level :
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker :
Dan Beeker
Company :
NXP Semiconductor
Skill Level :
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker :
Jamie Pacamarra
Company :
Analog Devices
Skill Level :
Audience:
When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the...
Speaker :
John Coonrod
Company :
Rogers Corp.
Skill Level :
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker :
Eric Bogatin
Company :
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker :
Elizabeth Bustamante
Company :
SnapEDA
Skill Level :
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker :
Bill Hargin
Company :
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker :
Paul Cooke
Company :
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker :
Eric Bogatin
Company :
Teledyne LeCroy
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
Speaker :
Phil Zarrow
Company :
ITM Consulting
Skill Level :
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
Speaker :
Lee Ritchey
Company :
Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker :
Benjamin Jordan
Skill Level :
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
Speaker :
Susy Webb
Company :
Design Science
Skill Level :
Audience:
Technical sessions at conferences often emphasize the latest techniques and technologies, but those classes are often too in-depth for a novice designer, and don’t speak to the questions from the...
