Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Doug Brooks and Dr. Johannes Adam
Skill Level :
Stop thinking about current density!
In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...
Speaker :
Zachariah Peterson
Company :
Northwest Engineering Solutions
High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker :
Atar Mittal
Company :
Sierra Circuits
Skill Level :
Signal degradation on PCB transmission lines manifests in many forms: undershoot, overshoot, ringing, pulse shape distortion, switching noise, attenuation, ground bounce, skew, etc. All these can be...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules...
Speaker :
Lee Ritchey
Company :
Speeding Edge
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the...
Speaker :
Ralf Bruening
Company :
Zuken
Skill Level :
Supply voltages decrease with every new silicon generation, contributing as well to the goal of reducing power consumption of our electronics. Coupled with the resulting shrinking noise margins for...
Speaker :
Dan Beeker
Company :
NXP Semiconductor
Skill Level :
This presentation will present a simple EM physics and geometry-based approach to designing power distribution networks on PCBs. From input power connection to the IC die, the simple rules discussed...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker :
John Coonrod
Company :
Rogers Corp.
Skill Level :
Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how...
Speaker :
Eric Bogatin
Company :
Teledyne LeCroy
A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no...
Speaker :
Bill Hargin
Company :
Z-zero
The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker :
Daniel Beeker
Company :
NXP Semiconductor
Skill Level :
Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...
Speaker :
Lee Ritchey
Company :
Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker :
Benjamin Jordan
Skill Level :
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
