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PCB Stackup Design and Materials Selection


Bill Hargin

 0 min 0 sec video

The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex, multilayer boards that work right the first time, within budget, and with reproducible results across multiple fabricators. The course will go into detail on tradeoffs between loss and cost, including dielectric loss, resistive loss, surface roughness, as well as glass-weave skew. After attending this course, students will be knowledgeable of PCB laminate tradeoffs, the laminate-materials market, and the process of troubleshooting problematic stackup designs. Attendees will also be exposed to cost-effective strategies for controlling loss and glass-weave skew.

Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
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Speaker  :  
Daniel Beeker
Company : 
NXP Semiconductor
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