Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Business/Markets

Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker  :  
Robert Carter
Company : 
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Keven Coates
Company : 
Geospace Technologies
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker  :  
Elizabeth Bustamante
Company : 
SnapEDA
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker  :  
Paul Cooke
Company : 
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker  :  
Phil Zarrow
Company : 
ITM Consulting
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker  :  
Benjamin Jordan
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
Speaker  :  
Michael R. Creeden
Company : 
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker  :  
Daniel J. Smith
Company : 
Raytheon SAS
Skill Level : 
Audience: 
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker  :  
Vern Solberg
Company : 
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker  :  
Rick Hartley
Company : 
RHartley Enterprises
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker  :  
Phil Zarrow
Company : 
ITM Consulting
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker  :  
Michael Ford, and Hemant Shah
Company : 
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker  :  
Benjamin Jordan
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...

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