Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.
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Speaker :
Greg Papandrew
Company :
Better Board Buyer
Skill Level :
Audience:
Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar?
What is...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Robert Carter
Company :
Oak-Mitsui Technologies
Large data transmission continues to increase annually due to live video streaming, cloud storage, PDA usage, IOT, and other technologies. Electronic devices are getting smaller yet required to...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Daniel J. Smith
Company :
Raytheon SAS
Skill Level :
Audience:
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Keven Coates
Company :
Geospace Technologies
Skill Level :
How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t...
Speaker :
Elizabeth Bustamante
Company :
SnapEDA
Skill Level :
When creating libraries, standards are crucial for maintaining consistency, accuracy, and reliability. Yet, even with rigid standards in place, mistakes inevitably creep into such a detail-oriented...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker :
Paul Cooke
Company :
AGC-Nelco Taconic
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface...
Speaker :
Phil Zarrow
Company :
ITM Consulting
Skill Level :
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
Speaker :
Ethan Pierce
Company :
Pierce Design
Skill Level :
Maintaining a product is very difficult when:
The source files aren’t available
Only Gerber files and maintenance documents are available
Making a revision to a company-owned product with no...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker :
Benjamin Jordan
Skill Level :
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
As use of artificial intelligence in electronics design and manufacturing becomes a discussion point, it recalls a similar debate from 40 years ago on the impact of a new technology -- SMT -- that...
Speaker :
Richard Weiland
Company :
HZO
Skill Level :
Engineered Reliability: Safeguarding Electrical Components and Devices with Nanocoating Technology, focuses on real-world examples of where significant product challenges were presented (such as...
Speaker :
Ethan Pierce
Company :
Pierce Design
Skill Level :
Maintaining a product is very difficult when:
The source files aren’t available
Only Gerber files and maintenance documents are available
Making a revision to a company-owned product with no...
Speaker :
Susy Webb
Company :
Design Science
Skill Level :
There is more to board design than placing parts and connecting the signals electrically. Those who design the board can make a huge impact on the ease of fabrication and assembly just by adhering...
Speaker :
Michael R. Creeden
Company :
CID+, Insulectro
With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Circuit boards for the IoT world (Internet of Things) are often driven by the need for low power dissipation, low cost (which drives very low layer count), moderate to high-density and mixed-signal...
Speaker :
Daniel J. Smith
Company :
Raytheon SAS
Skill Level :
Audience:
This half-day course is an overview (past, present, and future) of the interactions of processes, people and technologies involved in the complete lifecycle of a PCB design. This course is designed...
Speaker :
Vern Solberg
Company :
Solberg Technical Consulting
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...
Speaker :
Rick Hartley
Company :
RHartley Enterprises
Skill Level :
Power distribution in PCBs is the foundation around which all things work in the circuit. If this is not designed correctly, the entire circuit is at risk from noise and signal integrity issues, to...
Speaker :
Phil Zarrow
Company :
ITM Consulting
Skill Level :
This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is...
Speaker :
Lee Ritchey
Company :
Speeding Edge
With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...
Speaker :
Michael Ford, and Hemant Shah
Company :
Aegis Software, Cadence
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for...
Speaker :
Benjamin Jordan
Skill Level :
This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This...
