This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very high-current power supply rails, it is necessary to understand how materials behave and how PCBs are fabricated in order to arrive at a PCB stackup that results in a “right the first time” design. The seminar draws from the speaker’s long experience designing PCB stackup for products ranging from video games to supercomputers. It draws on the results of dozens of test PCBs used to characterize materials from a loss and high-speed skew perspective.