Designing and Analyzing High Frequency Interconnects

High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Electromagnetic Fields for Normal Folks: Show Me the Pictures and Hold the Equations, Please!

The material presented will be focused on the physics of electromagnetic energy basic principles, presented in easy-to-understand language with plenty of diagrams. Attendees will discover how... [more]

Designing the Signal Return Path

When designing a PCB, the signal routing and its return are critical to the circuit working properly. Great care is usually given to routing the signals, but often the return portion is the last... [more]