PCB Problem Solving – PCB 102

This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]

How to Save Up to 25% on Your PCB Purchases

Are your PCB buyers staying competitive in the face of COVID-19 restrictions, increased raw material and precious metal costs, rising freight prices, and a less competitive U.S. dollar? What is... [more]

The Mystery of Bypass Capacitors

How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]