PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

The Mystery of Bypass Capacitors

How do you design a high-speed digital circuit with enough bypass caps in the right area to supply all the peak power demands? You can’t listen to all the expert advice because it seems they can’t... [more]

Materials of Flex Circuits: Specifications and Applications

Materials of Flex Circuits: Specifications and Applications covers the following: Coverlays, cores, bond plies, adhesives and their suppliers  Flex layer processing and stackup Polyimides... [more]

PCB Design Techniques to Improve ESD Robustness

Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The... [more]