PCB Stackup Design and Materials Selection

The objective of this tutorial is to guide design teams through the process of evaluating and selecting the right laminate for a design, creating PCB stackups that meet the requirements of complex,... [more]

RF and Mixed Signal PCB Layout

This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

What Every Design Engineer Should Know About Design for SMT Manufacturability

This course is intended to provide the participant an understanding of how design issues interact with the SMT assembly processes. How design affects manufacturing capability and vice versa is... [more]