Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Current Workshops

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...

As most engineers and designers are aware, EMI occurs because some mechanical structure, within or attached to our system, is capable of resonating and radiating electromagnetic field energy. Those...

Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and...

Printed Circuit University offers Flexible, Affordable Electronics Education. We offer online classes from some the top professionals in their fields

Don't have an account yet? Register Now!

Sign in to your account