A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no... [more]
Today’s SMT and PTH assembly processes are driven by component packaging technology and functional design requirements. These requirements are driving manufacturing/test toward “build right” and... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
Some experts say you should never use a split ground plane. Others say you should use a split ground plane to control noise. When is the right time to split a ground plane? We will explore the... [more]