The Butterfly Effect in PCB Design: Optimization of High-speed Lines for an FMC Carrier Board

When signals start to get affected by the physical characteristics of the PCB, things start to get a little tricky. A simple point-to-point connection won’t be enough to keep the integrity of the... [more]

PC Board Grounding to Control Noise, EMI and Signal Integrity

When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]

Does a Differential Pair Need a Return Plane?

A differential pair is any two transmission lines. When each transmission line has a return plane, its pretty clear how the differential impedance is related to the geometry. But what if there is no... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]