High frequency PCB designs carry a unique set of challenges due to concentration of signal power in a narrow bandwidth. To design high frequency interconnects, designers must consider an entire... [more]
Raise the shields, Scotty! Starting with some simple definitions for ESD/EOS, this session describes the important differences in the energy involved and the type of damage that can result. The... [more]
The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
This comprehensive seminar of how to design a PCB stackup to optimize performance while attaining the lowest cost possible. With the advent of very high-speed signaling along with multiple very... [more]