This is a session for embedded engineers and PCB designers who have never done RF board layout but are curious and want to have a go at it. It is not for experienced microwave engineers. This... [more]
This session is intended for board designers to understand the things RF engineers request during PCB layout. Experienced RF engineers will likely not learn anything new from this course, as the... [more]
Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]
Have you ever had a noise-sensitive circuit and tried to find the noise source? Even after you completely encased sensitive portions in all sorts of shielding, you still had noise? It’s very... [more]