Flexible, Affordable Electronics Education
Online courses and webinars for the printed circuit engineering community.

Current Workshops

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level...

With the advent of ICs with multiple power rails at very high currents, the design of the power delivery system in a modern product is often more difficult than routing the PCB to ensure good signal...

Stop thinking about current density! In this 30-minute video, Doug Brooks and Dr. Johannes Adam explain the material parameters and properties that determine the temperature of a trace, how these...

Tired of failing EMC certification over and over? Join the crowd. Shrinking IC geometries and a resulting increase in switching speeds make designing compliant printed circuit boards more...

Printed Circuit University offers Flexible, Affordable Electronics Education. We offer online classes from some the top professionals in their fields

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