PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Differential Pair Routing for SI and EMI Control

Differential pairs have been used in PC boards for years to carry high-speed serial and high-speed parallel data, in a variety of bus formats. Many board designers and engineers believe the rules... [more]

Routing Digital Boards to Avoid Problems

There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses... [more]

PC Board Grounding to Control Noise, EMI and Signal Integrity

When time-varying (AC) signals travel in the transmission lines of a board, state-changing electric and magnetic fields are present. These fields, when not controlled, are the source of noise and... [more]