Next-Generation Materials: High-Speed, RF and HDI Designs

With this presentation, attendees will learn how materials matter in the 5G-world. From rigid laminates, copper styles and properties, flex materials, sintered paste OrMet for any-layer vias: all... [more]

Millimeter-Wave Concepts Can be Used to Optimize the Performance of High-Speed Digital Circuits

Understanding millimeter-wave (mmWave) concepts can benefit RF designers, high-speed digital circuit designers and fabricators. In the RF industry, as frequency increases many circuit properties... [more]

PCB Design and Assembly Process Strategy for High Density CSP, WLP, 2D and 3D Semiconductor Package Technology

Topics covered: 1. BGA/CSP process technologies and standards; single die BGA and FBGA packaging, flip-chip and die-size package technologies, wafer level packaging (WLP), fan-out wafer-level... [more]

Routing Digital Boards to Avoid Problems

There are many ways to route a PCB, some much more effective for signals than others. The first design rule is that the board must work properly, so it is important to have a plan that addresses... [more]