The new IPC Digital Twin standard (IPC-2551) defines an interoperable framework in which thousands of applications from multiple sources work seamlessly together, providing the opportunity for... [more]
This course will address advanced problem solving of printed wiring board defects. Some defects, such as interconnect separation, delamination, wedge voids, plating folds, micro-voids, surface... [more]
With an estimated 80,000 SMTP lines in use standards are a lifeline for line operators and equipment and software developers worldwide. SEMI is developing a suite of standards for SMT and PCBA... [more]
A step-by-step guideline for determining the PCB design requirements based on device energy consumption requirements. Wave cycle times and transmission line capacity form the basis of this... [more]